Insights into the Industry
The fan-out wafer level packaging industry has been witnessing optimal growth in recent years and is likely to continue even in upcoming years. The growth of fan-out wafer level packaging ’s industry size can be attributed to rising investments in research & development activities, entry of new players, product innovation, technological breakthroughs, effective allocation of resources, and growing competition among business rivals to expand its regional as well as customer base. Supportive government policies and incentives, as well as favorable laws, are projected to determine the growth of the fan-out wafer level packaging market in foreseeable future. An increase in the spending capacity of customers with the rise in disposable income will further contribute towards fan-out wafer level packaging 's market proceeds.
This market research report is a comprehensive overview of the events taking place in the fan-out wafer level packaging industry and impacting its growth. Our report divides the fan-out wafer level packaging market into various segments or categories based on products, applications, region, etc. Additionally, our research analysts have listed the key players of the global fan-out wafer level packaging market and compared them based on metrics such as market revenue, Y-O-Y sales, shipments volume, historical data, and successful implementation of business strategies such as strategic alliances, mergers & acquisitions, joint ventures, product development, and partnerships & collaborations.
Market Research Store (MRS) published a brand new report titled “Fan-out Wafer Level Packaging Market research report which is segmented by Products (Fan-out WLP, Fan-in WLP, Through Silicon Via (TSV), Integrated Passive Device (IPD)), by Applications (Consumer Electronics, Automotive, Defense and Aerospace, Medical, Others), by Key Players/Companies Tokyo Electron Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., Lam Research Corp, Fujitsu Ltd., Applied Materials Inc., ASML Holding NV, Deca Technologies, Amkor Technology Inc., Qualcomm Inc., Toshiba Corp.”. In 2020, the global fan-out wafer level packaging market value was registered at XX (USD Million/Billion) and is predicted to reach XX (USD Million/Billion) at a CAGR of XX% by 2028.
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| Report Attributes | Report Details |
|---|---|
| Report Title | Fan-out Wafer Level Packaging Market Research Report |
| By Products | Fan-out WLP, Fan-in WLP, Through Silicon Via (TSV), Integrated Passive Device (IPD) |
| By Applications | Consumer Electronics, Automotive, Defense and Aerospace, Medical, Others |
| By Key Players | Tokyo Electron Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., Lam Research Corp, Fujitsu Ltd., Applied Materials Inc., ASML Holding NV, Deca Technologies, Amkor Technology Inc., Qualcomm Inc., Toshiba Corp. |
| Regions Covered | North America, Europe, Asia Pacific (APAC), Latin America, Middle East And Africa (MEA) |
| Countries Covered | North America : U.S and Canada Europe : U.K, Spain, Germany, Italy, Russia, France, Rest of Europe APAC : Japan, India, China, Australia, South Korea, South East Asia, Rest of Asia Pacific Latin America : Mexico, Brazil The Middle East And Africa : South Africa, UAE, Saudi Arab, Rest of MEA |
| Base Year | 2020 |
| Historical Year | 2016to 2020 (Depending on availability, data from 2010 can be offered) |
| Forecast Year | 2028 |
| Number of Pages | 112 |
| Customization Available | Yes, the report can be tailored to meet your specific requirements. |
Based on these findings, the global fan-out wafer level packaging industry study suggests strategies to existing market participants as to how they can improve & reinforce their market position. In addition to this, the study also recommends successful market penetrating strategies for new entrants. Furthermore, fan-out wafer level packaging industry study report has included all major manufacturers and distributors operating in the fan-out wafer level packaging market across all major regions.
Fan-out Wafer Level Packaging Market Strategic Analysis
Various analytical methods such as Porter’s Five Force Analysis, SWOT analysis, Market Share Analysis, Competitive Analysis, PESTEL Analysis, Market Attractiveness Analysis, and Value Chain Analysis have been used to analyze the market in the research report. These assessments help users of the report in examining and evaluating fan-out wafer level packaging market on the basis of different metrics such as switching costs, economies of scale, current sales, brand loyalty, brand equity, capital investments, production rights, research & development activities, copyrights & patents, legislations, effects of promotional activities, and consumer preferences.
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The information provided in our market research report is anticipated to help the industry stakeholders in the effective decision-making process and successful business outcomes. Moreover, we have been using Ansoff Matrix to help firms analyze and plan their business growth strategies.
Additionally, our report contains a growth-share matrix that aids firms’ business decisions for prioritizing their myriad businesses. We have also included GE Nine Cell Matrix that is helpful in making strategic planning and can help firms in determining their position in the market along with analyzing their growth strategies.
Our researchers also make use of the perceptual map to demonstrate how to target consumers feel about a given brand and form perception about it. We have also included the Customer-Based Brand Equity (CBBE) Model for helping firms effectively position their brands.
Fan-out Wafer Level Packaging Market Key Trends Analysis
The key factors influencing the growth of the fan-out wafer level packaging market have been assessed in the report. Factors having a huge influence on market demand and restraining factors that impact the development of the market are both addressed rigorously & in-depth in our global market research report.
Furthermore, trends that play a key role in market’s growth are discussed comprehensively in the report. Moreover, a large number of qualitative factors or measurements are included in the report and this includes operating risks and major obstacles encountered by players in the industry.
Fan-out Wafer Level Packaging Market Key Segment Analysis
The report delivers a critical assessment on the fan-out wafer level packaging market by segmenting it based on Products, Applications, and region. All the segments and categories of the fan-out wafer level packaging market have been evaluated based on past, present and future trends and are key parameters determining & defining the growth of the market.
The data for the market and its segments and categories are provided from 2016 to 2028. The report has identified the key segments and categories contributing substantially towards overall market growth in terms of revenue & volume.
Based on Products, the global fan-out wafer level packaging market is segmented into Fan-out WLP, Fan-in WLP, Through Silicon Via (TSV), Integrated Passive Device (IPD). Comprehensive qualitative and quantitative this segment analysis will be provided in the report from 2016 to 2028.
Based on Applications, market is divided into Consumer Electronics, Automotive, Defense and Aerospace, Medical, Others. A slew of business growth opportunities and dynamics affecting the different segments are analyzed and discussed in the report.
Impact Assessment of COVID-19
The COVID-19 outbreak has wreaked havoc on worldwide economic and social systems. The disease has entered several industries' value and supply chains, including the fan-out wafer level packaging market. The government imposed lockdowns in various locations. We will examine the impact of the COVID-19 pandemic on the global market, looking at both demand and supply.
The COVID-19 pandemic's short- and long-term impacts would be explored to provide a summary. This would help build business plans for all market participants, including manufacturers, vendors, suppliers, distributors, and end-users, during and after the epidemic.
Fan-out Wafer Level Packaging Market Regional Trends and Market Player’s Analysis
On the basis of region, the market is segregated into North America, Latin America, Asia Pacific, Europe, and the Middle East & Africa.
The major players holding a huge chunk of market share in the global fan-out wafer level packaging market and impacting market profitability are evaluated after considering their product & services revenue, sales, business plans, innovations, and growth rate. The final position of a player in the market depends on market events or market happenings, new product launches, mergers & acquisitions, benchmarking, regional expansions, and technical innovations.
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For all the key stakeholders of the market, value chain and technology ecosystem, as well as the information provided in this market research report, will prove beneficial. The study offers an outline of the company’s market share and an extensive summary of the major players in the fan-out wafer level packaging market.
Some of the leading players profiled in the global fan-out wafer level packaging market are,
- Tokyo Electron Ltd.
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- Lam Research Corp
- Fujitsu Ltd.
- Applied Materials Inc.
- ASML Holding NV
- Deca Technologies
- Amkor Technology Inc.
- Qualcomm Inc.
- Toshiba Corp.
The Key Audiences for Fan-out Wafer Level Packaging Market Report
- Research Institutes & consulting firms
- Industry Leaders, as well as companies, aspiring to enter the fan-out wafer level packaging market
- Student and universities
- Solution Providers, product providers, service providers, and other players in the industry
- Associated private firms and government bodies
- Individuals interested to learn about market
The report segments of the global fan-out wafer level packaging market are as follows:
Global Fan-out Wafer Level Packaging Market: By Products
- Fan-out WLP
- Fan-in WLP
- Through Silicon Via (TSV)
- Integrated Passive Device (IPD)
Global Fan-out Wafer Level Packaging Market: By Applications
- Consumer Electronics
- Automotive
- Defense and Aerospace
- Medical
- Others
The Most Important Research Methodologies
Primary sources include industry experts from management corporations, processing organizations, and analytical service providers who serve businesses across the sector's value chain. We interviewed key sources to acquire qualitative and quantitative data and analyse future prospects.
Primary research undertaken for this report comprised interviews with industry professionals such as CEOs, Vice Presidents, Marketing Directors and Technology Directors of strong core organizations and institutions in major fan-out wafer level packaging . We interviewed them to get qualitative and quantitative data.
The following are the justifications for purchasing the global Fan-out Wafer Level Packaging market report:
- Statistical data is well-referenced, and the source is a significant resource for directing interested companies.
- Market development trends and marketing channels that are cutting-edge are discussed.
- The feasibility and growth rate of the market as a whole over the foreseeable future are determined.
- The competitive landscape and demographic research provide a clear picture of the current state of the market on an international scale.
- A thorough examination of development policies and plans, manufacturing processes, and costing provides a more accurate picture of import/export consumption, supply and demand, pricing, revenue, and gross margins, among other things.
- Customization is possible based on the client's requirements.
Frequently Asked Questions
- Tokyo Electron Ltd.
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- Lam Research Corp
- Fujitsu Ltd.
- Applied Materials Inc.
- ASML Holding NV
- Deca Technologies
- Amkor Technology Inc.
- Qualcomm Inc.
- Toshiba Corp.
Table Of Content
Table of Content 1 Report Overview 1.1 Study Scope 1.2 Key Market Segments 1.3 Regulatory Scenario by Region/Country 1.4 Market Investment Scenario Strategic 1.5 Market Analysis by Type 1.5.1 Global Fan-out Wafer Level Packaging Market Share by Type (2020-2026) 1.5.2 Fan-out WLP 1.5.3 Fan-in WLP 1.5.4 Through Silicon Via (TSV) 1.5.5 Integrated Passive Device (IPD) 1.6 Market by Application 1.6.1 Global Fan-out Wafer Level Packaging Market Share by Application (2020-2026) 1.6.2 Consumer Electronics 1.6.3 Automotive 1.6.4 Defense and Aerospace 1.6.5 Medical 1.6.6 Others 1.7 Fan-out Wafer Level Packaging Industry Development Trends under COVID-19 Outbreak 1.7.1 Global COVID-19 Status Overview 1.7.2 Influence of COVID-19 Outbreak on Fan-out Wafer Level Packaging Industry Development 2. Global Market Growth Trends 2.1 Industry Trends 2.1.1 SWOT Analysis 2.1.2 Porter’s Five Forces Analysis 2.2 Potential Market and Growth Potential Analysis 2.3 Industry News and Policies by Regions 2.3.1 Industry News 2.3.2 Industry Policies 2.4 Industry Trends Under COVID-19 3 Value Chain of Fan-out Wafer Level Packaging Market 3.1 Value Chain Status 3.2 Fan-out Wafer Level Packaging Manufacturing Cost Structure Analysis 3.2.1 Production Process Analysis 3.2.2 Manufacturing Cost Structure of Fan-out Wafer Level Packaging 3.2.3 Labor Cost of Fan-out Wafer Level Packaging 3.2.3.1 Labor Cost of Fan-out Wafer Level Packaging Under COVID-19 3.3 Sales and Marketing Model Analysis 3.4 Downstream Major Customer Analysis (by Region) 3.5 Value Chain Status Under COVID-19 4 Players Profiles 4.1 Tokyo Electron Ltd. 4.1.1 Tokyo Electron Ltd. Basic Information 4.1.2 Fan-out Wafer Level Packaging Product Profiles, Application and Specification 4.1.3 Tokyo Electron Ltd. Fan-out Wafer Level Packaging Market Performance (2015-2020) 4.1.4 Tokyo Electron Ltd. Business Overview 4.2 Jiangsu Changjiang Electronics Technology Co. Ltd. 4.2.1 Jiangsu Changjiang Electronics Technology Co. Ltd. Basic Information 4.2.2 Fan-out Wafer Level Packaging Product Profiles, Application and Specification 4.2.3 Jiangsu Changjiang Electronics Technology Co. Ltd. Fan-out Wafer Level Packaging Market Performance (2015-2020) 4.2.4 Jiangsu Changjiang Electronics Technology Co. Ltd. Business Overview 4.3 Lam Research Corp 4.3.1 Lam Research Corp Basic Information 4.3.2 Fan-out Wafer Level Packaging Product Profiles, Application and Specification 4.3.3 Lam Research Corp Fan-out Wafer Level Packaging Market Performance (2015-2020) 4.3.4 Lam Research Corp Business Overview 4.4 Fujitsu Ltd. 4.4.1 Fujitsu Ltd. Basic Information 4.4.2 Fan-out Wafer Level Packaging Product Profiles, Application and Specification 4.4.3 Fujitsu Ltd. Fan-out Wafer Level Packaging Market Performance (2015-2020) 4.4.4 Fujitsu Ltd. Business Overview 4.5 Applied Materials, Inc. 4.5.1 Applied Materials, Inc. Basic Information 4.5.2 Fan-out Wafer Level Packaging Product Profiles, Application and Specification 4.5.3 Applied Materials, Inc. Fan-out Wafer Level Packaging Market Performance (2015-2020) 4.5.4 Applied Materials, Inc. Business Overview 4.6 ASML Holding NV 4.6.1 ASML Holding NV Basic Information 4.6.2 Fan-out Wafer Level Packaging Product Profiles, Application and Specification 4.6.3 ASML Holding NV Fan-out Wafer Level Packaging Market Performance (2015-2020) 4.6.4 ASML Holding NV Business Overview 4.7 Deca Technologies 4.7.1 Deca Technologies Basic Information 4.7.2 Fan-out Wafer Level Packaging Product Profiles, Application and Specification 4.7.3 Deca Technologies Fan-out Wafer Level Packaging Market Performance (2015-2020) 4.7.4 Deca Technologies Business Overview 4.8 Amkor Technology Inc. 4.8.1 Amkor Technology Inc. Basic Information 4.8.2 Fan-out Wafer Level Packaging Product Profiles, Application and Specification 4.8.3 Amkor Technology Inc. Fan-out Wafer Level Packaging Market Performance (2015-2020) 4.8.4 Amkor Technology Inc. Business Overview 4.9 Qualcomm Inc. 4.9.1 Qualcomm Inc. Basic Information 4.9.2 Fan-out Wafer Level Packaging Product Profiles, Application and Specification 4.9.3 Qualcomm Inc. Fan-out Wafer Level Packaging Market Performance (2015-2020) 4.9.4 Qualcomm Inc. Business Overview 4.10 Toshiba Corp. 4.10.1 Toshiba Corp. Basic Information 4.10.2 Fan-out Wafer Level Packaging Product Profiles, Application and Specification 4.10.3 Toshiba Corp. Fan-out Wafer Level Packaging Market Performance (2015-2020) 4.10.4 Toshiba Corp. Business Overview 5 Global Fan-out Wafer Level Packaging Market Analysis by Regions 5.1 Global Fan-out Wafer Level Packaging Sales, Revenue and Market Share by Regions 5.1.1 Global Fan-out Wafer Level Packaging Sales by Regions (2015-2020) 5.1.2 Global Fan-out Wafer Level Packaging Revenue by Regions (2015-2020) 5.2 North America Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 5.3 Europe Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 5.4 Asia-Pacific Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 5.5 Middle East and Africa Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 5.6 South America Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 6 North America Fan-out Wafer Level Packaging Market Analysis by Countries 6.1 North America Fan-out Wafer Level Packaging Sales, Revenue and Market Share by Countries 6.1.1 North America Fan-out Wafer Level Packaging Sales by Countries (2015-2020) 6.1.2 North America Fan-out Wafer Level Packaging Revenue by Countries (2015-2020) 6.1.3 North America Fan-out Wafer Level Packaging Market Under COVID-19 6.2 United States Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 6.2.1 United States Fan-out Wafer Level Packaging Market Under COVID-19 6.3 Canada Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 6.4 Mexico Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 7 Europe Fan-out Wafer Level Packaging Market Analysis by Countries 7.1 Europe Fan-out Wafer Level Packaging Sales, Revenue and Market Share by Countries 7.1.1 Europe Fan-out Wafer Level Packaging Sales by Countries (2015-2020) 7.1.2 Europe Fan-out Wafer Level Packaging Revenue by Countries (2015-2020) 7.1.3 Europe Fan-out Wafer Level Packaging Market Under COVID-19 7.2 Germany Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 7.2.1 Germany Fan-out Wafer Level Packaging Market Under COVID-19 7.3 UK Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 7.3.1 UK Fan-out Wafer Level Packaging Market Under COVID-19 7.4 France Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 7.4.1 France Fan-out Wafer Level Packaging Market Under COVID-19 7.5 Italy Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 7.5.1 Italy Fan-out Wafer Level Packaging Market Under COVID-19 7.6 Spain Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 7.6.1 Spain Fan-out Wafer Level Packaging Market Under COVID-19 7.7 Russia Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 7.7.1 Russia Fan-out Wafer Level Packaging Market Under COVID-19 8 Asia-Pacific Fan-out Wafer Level Packaging Market Analysis by Countries 8.1 Asia-Pacific Fan-out Wafer Level Packaging Sales, Revenue and Market Share by Countries 8.1.1 Asia-Pacific Fan-out Wafer Level Packaging Sales by Countries (2015-2020) 8.1.2 Asia-Pacific Fan-out Wafer Level Packaging Revenue by Countries (2015-2020) 8.1.3 Asia-Pacific Fan-out Wafer Level Packaging Market Under COVID-19 8.2 China Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 8.2.1 China Fan-out Wafer Level Packaging Market Under COVID-19 8.3 Japan Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 8.3.1 Japan Fan-out Wafer Level Packaging Market Under COVID-19 8.4 South Korea Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 8.4.1 South Korea Fan-out Wafer Level Packaging Market Under COVID-19 8.5 Australia Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 8.6 India Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 8.6.1 India Fan-out Wafer Level Packaging Market Under COVID-19 8.7 Southeast Asia Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 8.7.1 Southeast Asia Fan-out Wafer Level Packaging Market Under COVID-19 9 Middle East and Africa Fan-out Wafer Level Packaging Market Analysis by Countries 9.1 Middle East and Africa Fan-out Wafer Level Packaging Sales, Revenue and Market Share by Countries 9.1.1 Middle East and Africa Fan-out Wafer Level Packaging Sales by Countries (2015-2020) 9.1.2 Middle East and Africa Fan-out Wafer Level Packaging Revenue by Countries (2015-2020) 9.1.3 Middle East and Africa Fan-out Wafer Level Packaging Market Under COVID-19 9.2 Saudi Arabia Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 9.3 UAE Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 9.4 Egypt Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 9.5 Nigeria Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 9.6 South Africa Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 10 South America Fan-out Wafer Level Packaging Market Analysis by Countries 10.1 South America Fan-out Wafer Level Packaging Sales, Revenue and Market Share by Countries 10.1.1 South America Fan-out Wafer Level Packaging Sales by Countries (2015-2020) 10.1.2 South America Fan-out Wafer Level Packaging Revenue by Countries (2015-2020) 10.1.3 South America Fan-out Wafer Level Packaging Market Under COVID-19 10.2 Brazil Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 10.2.1 Brazil Fan-out Wafer Level Packaging Market Under COVID-19 10.3 Argentina Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 10.4 Columbia Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 10.5 Chile Fan-out Wafer Level Packaging Sales and Growth Rate (2015-2020) 11 Global Fan-out Wafer Level Packaging Market Segment by Types 11.1 Global Fan-out Wafer Level Packaging Sales, Revenue and Market Share by Types (2015-2020) 11.1.1 Global Fan-out Wafer Level Packaging Sales and Market Share by Types (2015-2020) 11.1.2 Global Fan-out Wafer Level Packaging Revenue and Market Share by Types (2015-2020) 11.2 Fan-out WLP Sales and Price (2015-2020) 11.3 Fan-in WLP Sales and Price (2015-2020) 11.4 Through Silicon Via (TSV) Sales and Price (2015-2020) 11.5 Integrated Passive Device (IPD) Sales and Price (2015-2020) 12 Global Fan-out Wafer Level Packaging Market Segment by Applications 12.1 Global Fan-out Wafer Level Packaging Sales, Revenue and Market Share by Applications (2015-2020) 12.1.1 Global Fan-out Wafer Level Packaging Sales and Market Share by Applications (2015-2020) 12.1.2 Global Fan-out Wafer Level Packaging Revenue and Market Share by Applications (2015-2020) 12.2 Consumer Electronics Sales, Revenue and Growth Rate (2015-2020) 12.3 Automotive Sales, Revenue and Growth Rate (2015-2020) 12.4 Defense and Aerospace Sales, Revenue and Growth Rate (2015-2020) 12.5 Medical Sales, Revenue and Growth Rate (2015-2020) 12.6 Others Sales, Revenue and Growth Rate (2015-2020) 13 Fan-out Wafer Level Packaging Market Forecast by Regions (2020-2026) 13.1 Global Fan-out Wafer Level Packaging Sales, Revenue and Growth Rate (2020-2026) 13.2 Fan-out Wafer Level Packaging Market Forecast by Regions (2020-2026) 13.2.1 North America Fan-out Wafer Level Packaging Market Forecast (2020-2026) 13.2.2 Europe Fan-out Wafer Level Packaging Market Forecast (2020-2026) 13.2.3 Asia-Pacific Fan-out Wafer Level Packaging Market Forecast (2020-2026) 13.2.4 Middle East and Africa Fan-out Wafer Level Packaging Market Forecast (2020-2026) 13.2.5 South America Fan-out Wafer Level Packaging Market Forecast (2020-2026) 13.3 Fan-out Wafer Level Packaging Market Forecast by Types (2020-2026) 13.4 Fan-out Wafer Level Packaging Market Forecast by Applications (2020-2026) 13.5 Fan-out Wafer Level Packaging Market Forecast Under COVID-19 14 Appendix 14.1 Methodology 14.2 Research Data SourceInquiry For Buying
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Fan-out Wafer Level Packaging
