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3D IC (LED, Memories, MEMS, Sensor, Logic and Others) Market by Substrate Type (Silicon On Insulator and Bulk Silicon) and by Fabrication Process (Silicon Epitaxial Growth, Beam Re-Crystallization, Solid Phase Crystallization and Wafer Bonding) for Information and Communication Technology, Military, Consumer Electronics and Others Applications: Global Industry Perspective, Comprehensive Analysis, Size, Share, Growth, Segment, Trends and Forecast, 2014 - 2020

Published: Mar-2016 | Format: PDF | Zion | Number of pages: 110 | Code: MRS - 51272

 

The report covers forecast and analysis for the 3D IC market on a global and regional level. The study provides historic data of 2014 along with a forecast from 2015 to 2020 based on revenue (USD million). The study includes drivers and restraints for the 3D IC market along with the impact they have on the demand over the forecast period. Additionally, the report includes the study of opportunities available in the 3D IC market on a global level.

In order to give the users of this report a comprehensive view on the 3D IC market, we have included a detailed value chain analysis. To understand the competitive landscape in the market, an analysis of Porter’s Five Forces model for the 3D IC market has also been included. The study encompasses a market attractiveness analysis, wherein application segments are benchmarked based on their market size, growth rate and general attractiveness.

The study provides a decisive view on the 3D IC market by segmenting the market based on applications. All the application segments have been analyzed based on present and future trends and the market is estimated from 2014 to 2020. Key product market covered under this study includes LED, memories, MEMS, sensor, logic and others. Key product segments covered under this study includes LED, memories, MEMS, sensor, logic and others. Different substrate segments covered under this study includes silicon on insulator and bulk silicon. Major fabrication process segments covered under this study includes silicon epitaxial growth, beam re-crystallization, solid phase crystallization and wafer bonding. Some of the prime application segments covered under this study includes information and communication technology, military, consumer electronics and others applications. The regional segmentation includes the current and forecast demand for North America, Europe, Asia Pacific, Latin America and Middle East & Africa. This segmentation includes demand for 3D IC based on individual applications in all the regions.

The report also includes detailed profiles of end players such as 3M Company, Tezzaron Semiconductor Corporation, United Microelectronics Corporation, Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., Xilinx, STMicroelectronics and amongst others. The detailed description of players includes parameters such as company overview, financial overview, business strategies and recent developments of the company.

This report segments the global 3D IC market as follows:

3D IC Market:  Product Segment Analysis

  • LED
  • Memories
  • MEMS
  • Sensor
  • Logic
  • Others

3D IC Market:  Substrate Segment Analysis

  • Silicon on Insulator (SOI)
  • Bulk Silicon

3D IC Market:  Fabrication Process Segment Analysis

  • Silicon Epitaxial Growth
  • Beam Re-Crystallization
  • Solid Phase Crystallization
  • Wafer Bonding

3D IC Market:  Application Segment Analysis

  • Information and Communication Technology
  • Military
  • Consumer Electronics
  • Others

3D IC Market: Regional Segment Analysis

  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East and Africa
  • Chapter 1. Preface
    • 1.1. Report description and scope
    • 1.2. Research scope
    • 1.3. Research methodology
      • 1.3.1. Market research process
      • 1.3.2. Market research methodology
  • Chapter 2. Executive Summary
    • 2.1. Global 3D IC market, 2014 - 2020, (USD Million)
    • 2.2. 3D IC: Market snapshot
  • Chapter 3. 3D IC Market: Industry Analysis
    • 3.1. 3D IC: Market dynamics
    • 3.2. Market Drivers
      • 3.2.1. Growing demand of compact and high performance IC in end-industries
      • 3.2.2. Demand from consumer electronics and ICT industries
    • 3.3. Restraints
      • 3.3.1. High cost and thermal conductivity issues
    • 3.4. Opportunity
      • 3.4.1. emerging IT analytics in Asia Pacific region
    • 3.5. Porter’s Five Forces Analysis
    • 3.6. Market Attractiveness Analysis
      • 3.6.1. Market attractiveness analysis by product segment
      • 3.6.2. Market attractiveness analysis by substrate segment
      • 3.6.3. Market attractiveness analysis by fabrication process segment
      • 3.6.4. Market attractiveness analysis by application segment
      • 3.6.5. Market attractiveness analysis by regional segment
  • Chapter 4. Global 3D IC Market: Competitive Landscape
    • 4.1. Company market share analysis, 2014 (Subject to data availability)
    • 4.2. Price trend analysis
  • Chapter 5. Global 3D IC Market: Product Analysis
    • 5.1. Global 3D IC market share, by product, 2014 & 2020
    • 5.2. Global LED for 3D IC market, 2014 – 2020 (USD Million)
    • 5.3. Global memories for 3D IC market, 2014 – 2020 (USD Million)
    • 5.4. Global MEMS for 3D IC market, 2014 – 2020 (USD Million)
    • 5.5. Global sensor for 3D IC market, 2014 – 2020 (USD Million)
    • 5.6. Global logic for 3D IC market, 2014 – 2020 (USD Million)
    • 5.7. Global others for 3D IC market, 2014 – 2020 (USD Million)
  • Chapter 6. Global 3D IC Market: Substrate Type Analysis
    • 6.1. Global 3D IC market share, by substrate type, 2014 & 2020
    • 6.2. Global silicon on insulator (SOI) for 3D IC market, 2014 – 2020 (USD Million)
    • 6.3. Global bulk silicon for 3D IC market, 2014 – 2020 (USD Million)
  • Chapter 7. Global 3D IC Market: Fabrication Process Analysis
    • 7.1. Global 3D IC market share, by fabrication process, 2014 & 2020
    • 7.2. Global silicon epitaxial growth for 3D IC market, 2014 – 2020 (USD Million)
    • 7.3. Global beam re-crystallization for 3D IC market, 2014 – 2020 (USD Million)
    • 7.4. Global solid phase crystallization for 3D IC market, 2014 – 2020 (USD Million)
    • 7.5. Global wafer bonding for 3D IC market, 2014 – 2020 (USD Million)
  • Chapter 8. Global 3D IC Market: Applications Analysis
    • 8.1. Global 3D IC market share, by application, 2014 and 2020
    • 8.2. Global 3D IC market for information and communication technology, 2014 – 2020 (USD Million)
    • 8.3. Global 3D IC market for military, 2014 - 2020 (USD Million)
    • 8.4. Global 3D IC market for nanotechnology, 2014 - 2020 (USD Million)
    • 8.5. Global 3D IC market for consumer electronics, 2014 - 2020 (USD Million)
    • 8.6. Global 3D IC market for others, 2014 - 2020 (USD Million)
  • Chapter 9. 3D IC Market: Regional Analysis
    • 9.1. Global 3D IC market: Regional overview
      • 9.1.1. Global 3D IC market share, by region, 2014 and 2020
    • 9.2. North America
      • 9.2.1. North America 3D IC market revenue, by product, 2014 – 2020 (USD Million)
      • 9.2.2. North America 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
      • 9.2.3. North America 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
      • 9.2.4. North America 3D IC market revenue, by application, 2014 – 2020 (USD Million)
    • 9.3. Europe
      • 9.3.1. Europe 3D IC market revenue, by product, 2014 – 2020 (USD Million)
      • 9.3.2. Europe 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
      • 9.3.3. Europe 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
      • 9.3.4. Europe 3D IC market revenue, by application, 2014 – 2020 (USD Million)
    • 9.4. Asia Pacific
      • 9.4.1. Asia-Pacific 3D IC market revenue, by product, 2014 – 2020 (USD Million)
      • 9.4.2. Asia-Pacific 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
      • 9.4.3. Asia-Pacific 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
      • 9.4.4. Asia-Pacific 3D IC market revenue, by application, 2014 – 2020 (USD Million)
    • 9.5. Latin America
      • 9.5.1. Latin America 3D IC market revenue, by product, 2014 – 2020 (USD Million)
      • 9.5.2. Latin America 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
      • 9.5.3. Latin America 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
      • 9.5.4. Latin America 3D IC market revenue, by application, 2014 – 2020 (USD Million)
    • 9.6. Middle East and Africa
      • 9.6.1. Middle East and Africa 3D IC market revenue, by product, 2014 – 2020 (USD Million)
      • 9.6.2. Middle East and Africa 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
      • 9.6.3. Middle East and Africa 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
      • 9.6.4. Middle East and Africa 3D IC market revenue, by application, 2014 – 2020 (USD Million)
  • Chapter 10. Company Profiles
    • 10.1. 3M Company
      • 10.1.1. Overview
      • 10.1.2. Financials
      • 10.1.3. Product portfolio
      • 10.1.4. Business strategy
      • 10.1.5. Recent developments
    • 10.2. Tezzaron Semiconductor Corporation
      • 10.2.1. Overview
      • 10.2.2. Financials
      • 10.2.3. Product portfolio
      • 10.2.4. Business strategy
      • 10.2.5. Recent developments
    • 10.3. United Microelectronics Corporation
      • 10.3.1. Overview
      • 10.3.2. Financials
      • 10.3.3. Product portfolio
      • 10.3.4. Business strategy
      • 10.3.5. Recent developments
    • 10.4. Samsung
      • 10.4.1. Overview
      • 10.4.2. Financials
      • 10.4.3. Product portfolio
      • 10.4.4. Business strategy
      • 10.4.5. Recent developments
    • 10.5. Taiwan Semiconductor Manufacturing Company, Ltd.
      • 10.5.1. Overview
      • 10.5.2. Financials
      • 10.5.3. Product portfolio
      • 10.5.4. Business strategy
      • 10.5.5. Recent developments
    • 10.6. Xilinx
      • 10.6.1. Overview
      • 10.6.2. Financials
      • 10.6.3. Product portfolio
      • 10.6.4. Business strategy
      • 10.6.5. Recent developments
    • 10.7. STMicroelectronics
      • 10.7.1. Overview
      • 10.7.2. Financials
      • 10.7.3. Product portfolio
      • 10.7.4. Business strategy
      • 10.7.5. Recent developments

List of Tables

1. Global 3D IC market snapshot
2. Drivers for 3D IC market: Impact analysis
3. Restraints of 3D IC market: Impact analysis
4. North America 3D IC market revenue, by product, 2014 – 2020 (USD Million)
5. North America 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
6. North America 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
7. North America 3D IC market revenue, by application, 2014 – 2020 (USD Million)
8. Europe 3D IC market revenue, by product, 2014 – 2020 (USD Million)
9. Europe 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
10. Europe 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
11. Europe 3D IC market revenue, by application, 2014 – 2020 (USD Million)
12. Asia Pacific 3D IC market revenue, by product, 2014 – 2020 (USD Million)
13. Asia Pacific 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
14. Asia Pacific 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
15. Asia Pacific 3D IC market revenue, by application, 2014 – 2020 (USD Million)
16. Latin America 3D IC market revenue, by product, 2014 – 2020 (USD Million)
17. Latin America 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
18. Latin America 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
19. Latin America 3D IC market revenue, by application, 2014 – 2020 (USD Million)
20. Middle East & Africa 3D IC market revenue, by product, 2014 – 2020 (USD Million)
21. Middle East & Africa 3D IC market revenue, by substrate type, 2014 – 2020 (USD Million)
22. Middle East & Africa 3D IC market revenue, by fabrication process, 2014 – 2020 (USD Million)
23. Middle East & Africa 3D IC market revenue, by application, 2014 – 2020 (USD Million)


List of Figures
 
1. Global 3D IC market segmentation by product, substrate type, fabrication process, application, and geography
2. Global 3D IC market, 2014 - 2020 (USD Million)
3. Porter’s five forces analysis: 3D IC market
4. Global 3D IC market attractiveness, by product
5. Global 3D IC market attractiveness, by substrate type
6. Global 3D IC market attractiveness, by fabrication process
7. Global 3D IC market attractiveness, by application
8. Global 3D IC market attractiveness, by region
9. Global 3D IC market share, by product, 2014 -2020
10. Global LED for 3D IC market, 2014 – 2020 (USD Million)
11. Global memories for 3D IC market, 2014 – 2020 (USD Million)
12. Global MEMS for 3D IC market, 2014 – 2020 (USD Million)
13. Global sensor for 3D IC market, 2014 – 2020 (USD Million)
14. Global logic for 3D IC market, 2014 – 2020 (USD Million)
15. Global others for 3D IC market, 2014 – 2020 (USD Million)
16. Global 3D IC market share, by substrate type, 2014 -2020
17. Global silicon on insulator for 3D IC market, 2014 – 2020 (USD Million)
18. Global bulk silicon for 3D IC market, 2014 – 2020 (USD Million)
19. Global 3D IC market share, by fabrication process, 2014 -2020
20. Global 3D IC market for silicon epitaxial growth, 2014 – 2020 (USD Million)
21. Global 3D IC market for beam re-crystallization, 2014 – 2020 (USD Million)
22. Global 3D IC market for wafer bonding, 2014 – 2020 (USD Million)
23. Global 3D IC market share, by application, 2014 -2020
24. Global 3D IC market for information and communication technology, 2014 – 2020 (USD Million)
25. Global 3D IC market for military, 2014 - 2020 (USD Million)
26. Global 3D IC market for consumer electronics, 2014 - 2020 (USD Million)
27. Global 3D IC market for others, 2014 - 2020 (USD Million)
28. Global 3D IC market share, by region, 2014 - 2020
29. North America 3D IC market, 2014 - 2020, (USD Million)
30. Europe 3D IC market, 2014 - 2020, (USD Million)
31. Asia Pacific 3D IC market, 2014 – 2020, (USD Million)
32. Latin America 3D IC market, 2014-2020,(USD Million)
33. Middle East & Africa 3D IC market, 2014 - 2020, (USD Million)

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Zion Research uses the synergy of combination of both primary research and secondary research for its research reports. For this study, we have conducted extensive primary research, wherein we have conducted in-depth interviews of the key opinion leader of this industry. Primary research make up for the biggest chunk of our data sources in addition to secondary research.

We referred to product literature of leading industry participants, annual reports, press releases, government publications, and other relevant sources for data collection and analysis thereof. Secondary research also includes a search of recent trade journals, technical writing, internet sources, and statistical data from government websites, trade associations and agencies.  

Zion Research has collected key data related to the 3D IC Market and analyzed these data using a variety of methods. The market dynamics have been ascertained following a detailed study of the micro, meso, and macroeconomic indicators of the market.

This report is based on in-depth qualitative and quantitative analyses of the Global 3D IC Market. The quantitative analysis involved the application of various projection and sampling techniques. The qualitative analysis involved primary interviews, surveys, and vendor briefings. The data gathered as a result of these processes were validated through experts' opinions.

Primary Research

We conduct primary interviews with industry participants and commentators on an ongoing basis to validate data and analysis. A typical research interview fulfills the following functions:

  • Provides firsthand information on market size, market trends, growth trends, competitive landscape, outlook, etc.
  • Helps in validating and strengthening the secondary research findings
  • Further develops the analysis team’s expertise and market understanding
  • Primary research involves e-mail interactions, telephonic interviews as well as face-to-face interviews for each market, category, segment and sub-segment across geographies

Participants who typically partake in such a process include, but are not limited to:

  • Industry participants: CEOs, VPs, marketing/product managers, market intelligence managers and national sales managers
  • Purchasing managers, technical personnel, distributors and resellers
  • Outside experts: Investment bankers, valuation experts and research analysts specializing in specific markets

Key opinion leaders specializing in different areas corresponding to different industry verticals

Secondary Research

Secondary research sources that are typically referred to include, but are not limited to:

  • Company websites, annual reports, financial reports, broker reports, investor presentations and SEC filings
  • IDC and other relevant magazines
  • Internal and external proprietary databases, and relevant patent and regulatory databases
  • National government documents, statistical databases and market reports

News articles, press releases and webcasts specific to companies operating in the market

Based on the research results and technical insights thus gathered, Zion research analysts have provided a comprehensive analysis of the varied aspects of the market. The impact of global economic conditions and other macroeconomic indicators was also considered when assessing the market.

Models

Where no hard data is available, we use models and estimates to produce comprehensive data sets. A rigorous methodology is adopted, wherein the available hard data is cross-referenced with the following data types to produce estimates:

  • Demographic data: Population split by segments
  • Macroeconomic indicators: GDP, PPP, Per Capita Income, etc.
  • Industry indicators: Expenditure, technology stage and infrastructure, sector growth and facilities
  • Data is then cross-checked by an expert panel.

In technology world, three dimensional integrated circuits (3D IC) is a new invention of integrated circuits. In 3D IC the integrated circuits are stack on each other in three dimensional perspectives. The 3D IC consists of numerous components placed on a single chip stack on each other. This design and fabrication process of 3D IC helps to reduce size and enhance the speed of the chip which is used in various applications. Due to 3D technology, the IC chip becomes compact thus getting popular among key manufacturers. Due to various advantages 3D IC has wide range of utilization in end-application.

The 3D IC market is primarily driven by growing demand of compact and high performance IC in end-industries. Demand from consumer electronics and ICT is expected to accelerate the performance of the market during the forecast period due to the attributes such as portability and durability. However, high cost and thermal conductivity issues are the major restraints that may impede the growth of the market. Moreover, emerging IT analytics in Asia Pacific region is likely to open new opportunities for 3D IC market.

3D IC Market

Based on product segment, 3D IC market is classified as LED, memories, MEMS, sensor, logic and others. Memories, MEMS and sensors together held dominating position in 3D IC market. They were accounted more than 60% shares of the total revenue generated of the market. Improving technical aspects in conventional IC due to the research and inventions, end products like memories, sensors and MEMS are expected to experience lucrative growth during the years to come. Moreover, LED is likely to have positive impact on the market growth due to rising penetration of consumer goods in LED market.

3D IC technology uses two type of substrate namely silicon on insulator (SOI) and bulk silicon. Among two, SOI substrate is is actively employed in end-uses because it exhibit low heat generation and parasitic capacitance. Further, silicon epitaxial growth, beam re-crystallization, solid phase crystallization and wafer bonding are the major fabrication process segments involved in 3D technology. Wafer bonding is the leading the fabrication process segment. It is extensively utilized because it bonds the component without many complexities and reduces the size of the integrated chip as well as power consumption.

Various end-use industry sectors such as consumer electronics, information and communication technology, military and others are seeking ways to take advantage of 3D IC technology. Among all, information and communication was one of the foremost segments of 3D IC market in 2014. It accounted for around 25% share of the total revenue generated and projected to remain dominant application segment In addition, consumer goods is expected to be the fastest growing application as 3D ICs offer an innovative approach for developing broader set of consumer electronic systems such as television sets, audio equipment, tablets, smartphones, cameras and home appliances.

With over 40% shares in total revenue generated, Asia Pacific was the largest market for 3D IC in 2014. For the same year, North America was the second largest regional market for 3D IC. Asia Pacific is predicted to continue its dominance in3D IC market owing to significant demand from emerging consumer electronics industries.

Some of the key players of global 3D IC market include 3M Company, Tezzaron Semiconductor Corporation, Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., United Microelectronics Corporation, Xilinx, STMicroelectronics and amongst others.

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