2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.

3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers.

Scope of the Report:

The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

In terms of Technology, the market is categorised into 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP).

Depending on Application, the market is classified into MEMS/Sensors, logic, imaging & optoelectronics, power, analog & mixed signal, RF, photonics, memory and LED.

The worldwide market for 3D IC & 2.5D IC Packaging is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.

This report focuses on the 3D IC & 2.5D IC Packaging in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers

Intel Corporation

Toshiba Corp

Samsung Electronics

Stmicroelectronics

Taiwan Semiconductor Manufacturing

Amkor Technology

United Microelectronics

Broadcom

ASE Group

Pure Storage

Advanced Semiconductor Engineering

Market Segment by Regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia and Italy)

Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

South America (Brazil, Argentina, Colombia etc.)

Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers

3D TSV

2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

Market Segment by Applications, can be divided into

Automotive

Consumer electronics

Medical devices

Military & aerospace

Telecommunication

Industrial sector and smart technologies

There are 15 Chapters to deeply display the global 3D IC & 2.5D IC Packaging market.

Chapter 1, to describe 3D IC & 2.5D IC Packaging Introduction, product scope, market overview, market opportunities, market risk, market driving force;

Chapter 2, to analyze the top manufacturers of 3D IC & 2.5D IC Packaging, with sales, revenue, and price of 3D IC & 2.5D IC Packaging, in 2016 and 2017;

Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;

Chapter 4, to show the global market by regions, with sales, revenue and market share of 3D IC & 2.5D IC Packaging, for each region, from 2013 to 2018;

Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;

Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;

Chapter 12, 3D IC & 2.5D IC Packaging market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;

Chapter 13, 14 and 15, to describe 3D IC & 2.5D IC Packaging sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

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Table Of Content

Table of Contents



1 Market Overview

    1.1 3D IC & 2.5D IC Packaging Introduction

    1.2 Market Analysis by Type

        1.2.1 3D TSV

        1.2.2 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

    1.3 Market Analysis by Applications

        1.3.1 Automotive

        1.3.2 Consumer electronics

        1.3.3 Medical devices

        1.3.4 Military & aerospace

        1.3.5 Telecommunication

        1.3.6 Industrial sector and smart technologies

    1.4 Market Analysis by Regions

        1.4.1 North America (United States, Canada and Mexico)

            1.4.1.1 United States Market States and Outlook (2013-2023)

            1.4.1.2 Canada Market States and Outlook (2013-2023)

            1.4.1.3 Mexico Market States and Outlook (2013-2023)

        1.4.2 Europe (Germany, France, UK, Russia and Italy)

            1.4.2.1 Germany Market States and Outlook (2013-2023)

            1.4.2.2 France Market States and Outlook (2013-2023)

            1.4.2.3 UK Market States and Outlook (2013-2023)

            1.4.2.4 Russia Market States and Outlook (2013-2023)

            1.4.2.5 Italy Market States and Outlook (2013-2023)

        1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

            1.4.3.1 China Market States and Outlook (2013-2023)

            1.4.3.2 Japan Market States and Outlook (2013-2023)

            1.4.3.3 Korea Market States and Outlook (2013-2023)

            1.4.3.4 India Market States and Outlook (2013-2023)

            1.4.3.5 Southeast Asia Market States and Outlook (2013-2023)

        1.4.4 South America, Middle East and Africa

            1.4.4.1 Brazil Market States and Outlook (2013-2023)

            1.4.4.2 Egypt Market States and Outlook (2013-2023)

            1.4.4.3 Saudi Arabia Market States and Outlook (2013-2023)

            1.4.4.4 South Africa Market States and Outlook (2013-2023)

            1.4.4.5 Nigeria Market States and Outlook (2013-2023)

    1.5 Market Dynamics

        1.5.1 Market Opportunities

        1.5.2 Market Risk

        1.5.3 Market Driving Force

2 Manufacturers Profiles

    2.1 Intel Corporation

        2.1.1 Business Overview

        2.1.2 3D IC & 2.5D IC Packaging Type and Applications

            2.1.2.1 Product A

            2.1.2.2 Product B

        2.1.3 Intel Corporation 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.2 Toshiba Corp

        2.2.1 Business Overview

        2.2.2 3D IC & 2.5D IC Packaging Type and Applications

            2.2.2.1 Product A

            2.2.2.2 Product B

        2.2.3 Toshiba Corp 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.3 Samsung Electronics

        2.3.1 Business Overview

        2.3.2 3D IC & 2.5D IC Packaging Type and Applications

            2.3.2.1 Product A

            2.3.2.2 Product B

        2.3.3 Samsung Electronics 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.4 Stmicroelectronics

        2.4.1 Business Overview

        2.4.2 3D IC & 2.5D IC Packaging Type and Applications

            2.4.2.1 Product A

            2.4.2.2 Product B

        2.4.3 Stmicroelectronics 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.5 Taiwan Semiconductor Manufacturing

        2.5.1 Business Overview

        2.5.2 3D IC & 2.5D IC Packaging Type and Applications

            2.5.2.1 Product A

            2.5.2.2 Product B

        2.5.3 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.6 Amkor Technology

        2.6.1 Business Overview

        2.6.2 3D IC & 2.5D IC Packaging Type and Applications

            2.6.2.1 Product A

            2.6.2.2 Product B

        2.6.3 Amkor Technology 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.7 United Microelectronics

        2.7.1 Business Overview

        2.7.2 3D IC & 2.5D IC Packaging Type and Applications

            2.7.2.1 Product A

            2.7.2.2 Product B

        2.7.3 United Microelectronics 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.8 Broadcom

        2.8.1 Business Overview

        2.8.2 3D IC & 2.5D IC Packaging Type and Applications

            2.8.2.1 Product A

            2.8.2.2 Product B

        2.8.3 Broadcom 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.9 ASE Group

        2.9.1 Business Overview

        2.9.2 3D IC & 2.5D IC Packaging Type and Applications

            2.9.2.1 Product A

            2.9.2.2 Product B

        2.9.3 ASE Group 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.10 Pure Storage

        2.10.1 Business Overview

        2.10.2 3D IC & 2.5D IC Packaging Type and Applications

            2.10.2.1 Product A

            2.10.2.2 Product B

        2.10.3 Pure Storage 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.11 Advanced Semiconductor Engineering

        2.11.1 Business Overview

        2.11.2 3D IC & 2.5D IC Packaging Type and Applications

            2.11.2.1 Product A

            2.11.2.2 Product B

        2.11.3 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

3 Global 3D IC & 2.5D IC Packaging Sales, Revenue, Market Share and Competition by Manufacturer (2016-2017)

    3.1 Global 3D IC & 2.5D IC Packaging Sales and Market Share by Manufacturer (2016-2017)

    3.2 Global 3D IC & 2.5D IC Packaging Revenue and Market Share by Manufacturer (2016-2017)

    3.3 Market Concentration Rate

        3.3.1 Top 3 3D IC & 2.5D IC Packaging Manufacturer Market Share in 2017

        3.3.2 Top 6 3D IC & 2.5D IC Packaging Manufacturer Market Share in 2017

    3.4 Market Competition Trend

4 Global 3D IC & 2.5D IC Packaging Market Analysis by Regions

    4.1 Global 3D IC & 2.5D IC Packaging Sales, Revenue and Market Share by Regions

        4.1.1 Global 3D IC & 2.5D IC Packaging Sales and Market Share by Regions (2013-2018)

        4.1.2 Global 3D IC & 2.5D IC Packaging Revenue and Market Share by Regions (2013-2018)

    4.2 North America 3D IC & 2.5D IC Packaging  Sales and Growth Rate (2013-2018)

    4.3 Europe 3D IC & 2.5D IC Packaging  Sales and Growth Rate (2013-2018)

    4.4 Asia-Pacific 3D IC & 2.5D IC Packaging  Sales and Growth Rate (2013-2018)

    4.5 South America 3D IC & 2.5D IC Packaging  Sales and Growth Rate (2013-2018)

    4.6 Middle East and Africa 3D IC & 2.5D IC Packaging  Sales and Growth Rate (2013-2018)

5 North America 3D IC & 2.5D IC Packaging by Countries

    5.1 North America 3D IC & 2.5D IC Packaging Sales, Revenue and Market Share by Countries

        5.1.1 North America 3D IC & 2.5D IC Packaging Sales and Market Share by Countries (2013-2018)

        5.1.2 North America 3D IC & 2.5D IC Packaging Revenue and Market Share by Countries (2013-2018)

    5.2 United States 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    5.3 Canada 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    5.4 Mexico 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

6 Europe 3D IC & 2.5D IC Packaging by Countries

    6.1 Europe 3D IC & 2.5D IC Packaging Sales, Revenue and Market Share by Countries

        6.1.1 Europe 3D IC & 2.5D IC Packaging Sales and Market Share by Countries (2013-2018)

        6.1.2 Europe 3D IC & 2.5D IC Packaging Revenue and Market Share by Countries (2013-2018)

    6.2 Germany 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    6.3 UK 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    6.4 France 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    6.5 Russia 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    6.6 Italy 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

7 Asia-Pacific 3D IC & 2.5D IC Packaging by Countries

    7.1 Asia-Pacific 3D IC & 2.5D IC Packaging Sales, Revenue and Market Share by Countries

        7.1.1 Asia-Pacific 3D IC & 2.5D IC Packaging Sales and Market Share by Countries (2013-2018)

        7.1.2 Asia-Pacific 3D IC & 2.5D IC Packaging Revenue and Market Share by Countries (2013-2018)

    7.2 China 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    7.3 Japan 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    7.4 Korea 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    7.5 India 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    7.6 Southeast Asia 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

8 South America 3D IC & 2.5D IC Packaging by Countries

    8.1 South America 3D IC & 2.5D IC Packaging Sales, Revenue and Market Share by Countries

        8.1.1 South America 3D IC & 2.5D IC Packaging Sales and Market Share by Countries (2013-2018)

        8.1.2 South America 3D IC & 2.5D IC Packaging Revenue and Market Share by Countries (2013-2018)

    8.2 Brazil 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    8.3 Argentina 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    8.4 Colombia 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

9 Middle East and Africa 3D IC & 2.5D IC Packaging by Countries

    9.1 Middle East and Africa 3D IC & 2.5D IC Packaging Sales, Revenue and Market Share by Countries

        9.1.1 Middle East and Africa 3D IC & 2.5D IC Packaging Sales and Market Share by Countries (2013-2018)

        9.1.2 Middle East and Africa 3D IC & 2.5D IC Packaging Revenue and Market Share by Countries (2013-2018)

    9.2 Saudi Arabia 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    9.3 UAE 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    9.4 Egypt 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    9.5 Nigeria 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

    9.6 South Africa 3D IC & 2.5D IC Packaging Sales and Growth Rate (2013-2018)

10 Global 3D IC & 2.5D IC Packaging Market Segment by Type

    10.1 Global 3D IC & 2.5D IC Packaging Sales, Revenue and Market Share by Type (2013-2018)

        10.1.1 Global 3D IC & 2.5D IC Packaging Sales and Market Share by Type (2013-2018)

        10.1.2 Global 3D IC & 2.5D IC Packaging Revenue and Market Share by Type (2013-2018)

    10.2 3D TSV Sales Growth and Price

        10.2.1 Global 3D TSV Sales Growth (2013-2018)

        10.2.2 Global 3D TSV Price (2013-2018)

    10.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Sales Growth and Price

        10.3.1 Global 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Sales Growth (2013-2018)

        10.3.2 Global 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Price (2013-2018)

11 Global 3D IC & 2.5D IC Packaging Market Segment by Application

    11.1 Global 3D IC & 2.5D IC Packaging Sales Market Share by Application (2013-2018)

    11.2 Automotive Sales Growth (2013-2018)

    11.3 Consumer electronics Sales Growth (2013-2018)

    11.4 Medical devices Sales Growth (2013-2018)

    11.5 Military & aerospace Sales Growth (2013-2018)

    11.6 Telecommunication Sales Growth (2013-2018)

    11.7 Industrial sector and smart technologies Sales Growth (2013-2018)

12 3D IC & 2.5D IC Packaging Market Forecast (2018-2023)

    12.1 Global 3D IC & 2.5D IC Packaging Sales, Revenue and Growth Rate (2018-2023)

    12.2 3D IC & 2.5D IC Packaging Market Forecast by Regions (2018-2023)

        12.2.1 North America 3D IC & 2.5D IC Packaging Market Forecast (2018-2023)

        12.2.2 Europe 3D IC & 2.5D IC Packaging Market Forecast (2018-2023)

        12.2.3 Asia-Pacific 3D IC & 2.5D IC Packaging Market Forecast (2018-2023)

        12.2.4 South America 3D IC & 2.5D IC Packaging Market Forecast (2018-2023)

        12.2.5 Middle East and Africa 3D IC & 2.5D IC Packaging Market Forecast (2018-2023)

    12.3 3D IC & 2.5D IC Packaging Market Forecast by Type (2018-2023)

        12.3.1 Global 3D IC & 2.5D IC Packaging Sales Forecast by Type (2018-2023)

        12.3.2 Global 3D IC & 2.5D IC Packaging Market Share Forecast by Type (2018-2023)

    12.4 3D IC & 2.5D IC Packaging Market Forecast by Application (2018-2023)

        12.4.1 Global 3D IC & 2.5D IC Packaging Sales Forecast by Application (2018-2023)

        12.4.2 Global 3D IC & 2.5D IC Packaging Market Share Forecast by Application (2018-2023)

13 Sales Channel, Distributors, Traders and Dealers

    13.1 Sales Channel

        13.1.1 Direct Marketing

        13.1.2 Indirect Marketing

        13.1.3 Marketing Channel Future Trend

    13.2 Distributors, Traders and Dealers

14 Research Findings and Conclusion

15 Appendix

    15.1 Methodology

    15.2 Data Source

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