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Global 3D Time-of-flight Image Sensor Market Research by Company, Type & Application 2018-2025

Published: Apr-2018 | Format: PDF | HeyReport | Number of pages: 85 | Code: MRS - 252800

Summary
3D time-of-flight (ToF) sensor is part of the 3D ToF image sensor family. The device combines ToF sensing with an optimally-designed analog-to-digital converter (ADC) and a versatile, programmable timing generator (TG). 
Market Segment as follows:
By Type
    Half-QQVGA ToF Image Sensor
    QVGA ToF Image Sensor
    Others
By Application
    Consumer Electronics
    Robotics and Drone
    Machine Vision and Industrial Automation
    Entertainment
    Automobile
    Others
By Company
    Texas Instruments
    STMicroelectronics
    PMD Technologies
    Infineon
    PrimeSense (Apple)
    MESA (Heptagon)
    Melexis
    ifm Electronic
    Canesta (Microsoft)
    Espros Photonics
    TriDiCam
The main contents of the report including:
Section 1:
Product definition, type and application, global market overview;
Section 2:
Global Market competition by company;
Section 3:
Global sales revenue, volume and price by type;
Section 4:
Global sales revenue, volume and price by application;
Section 5:
export and import;
Section 6:
Company information, business overview, sales data and product specifications;
Section 7:
Industry chain and raw materials;
Section 8:
SWOT and Porter's Five Forces;
Section 9:
Conclusion.
Table of Contents
1 Market Overview
    1.1 Market Segment Overview
        1.1.1 Product Definition
        1.1.2 Market by Type
            1.1.2.1 Half-QQVGA ToF Image Sensor
            1.1.2.2 QVGA ToF Image Sensor
            1.1.2.3 Others
        1.1.3 Market by Application
            1.1.3.1 Consumer Electronics
            1.1.3.2 Robotics and Drone
            1.1.3.3 Machine Vision and Industrial Automation
            1.1.3.4 Entertainment
            1.1.3.5 Automobile
            1.1.3.6 Others
    1.2 Global and Regional Market Size
        1.2.1 Global Overview
        1.2.2 United States Overview
2 Global and Regional Market by Company
    2.1 Global
        2.1.1 Global Sales by Company
        2.1.2 Global Price by Company
    2.2 United States
        2.2.1 United States Sales by Company
        2.2.2 United States Price by Company
3 Global and Regional Market by Type
    3.1 Global
        3.1.1 Global Sales by Type
        3.1.2 Global Price by Type
    3.2 United States
        3.2.1 United States Sales by Type
        3.2.2 United States Price by Type
4 Global and Regional Market by Application
    4.1 Global
        4.1.1 Global Sales by Application
        4.1.2 Global Price by Application
    4.2 United States
        4.2.1 United States Sales by Application
        4.2.2 United States Price by Application
5 Regional Trade
    5.1 Export
    5.2 Import
6 Key Manufacturers
    6.1 Texas Instruments
        6.1.2 Company Information
        6.1.2 Product Specifications
        6.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    6.2 STMicroelectronics
        6.2.1 Company Information
        6.2.2 Product Specifications
        6.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    6.3 PMD Technologies
        6.3.1 Company Information
        6.3.2 Product Specifications
        6.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    6.4 Infineon
        6.4.1 Company Information
        6.4.2 Product Specifications
        6.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    6.5 PrimeSense (Apple)
        6.5.1 Company Information
        6.5.2 Product Specifications
        6.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    6.6 MESA (Heptagon)
        6.6.1 Company Information
        6.6.2 Product Specifications
        6.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    6.7 Melexis
        6.7.1 Company Information
        6.7.2 Product Specifications
        6.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    6.8 ifm Electronic
        6.8.1 Company Information
        6.8.2 Product Specifications
        6.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    6.9 Canesta (Microsoft)
        6.9.1 Company Information
        6.9.2 Product Specifications
        6.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    6.10 Espros Photonics
        6.10.1 Company Information
        6.10.2 Product Specifications
        6.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    6.11 TriDiCam
7 Industry Upstream
    7.1 Industry Chain
    7.2 Raw Materials
8 Market Environment
    8.1 SWOT
    8.2 Porter's Five Forces
9 Conclusion

                        
            

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