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Global Semiconductor Packaging and Assembly Equipments Market 2018 by Manufacturers, Regions, Type and Application, Forecast to 2023

Published: Sep-2018 | Format: PDF | Global Info Research | Number of pages: 116 | Code: MRS - 353440

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation.



Scope of the Report:

This report focuses on the Semiconductor Packaging and Assembly Equipments in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

The die-level packaging and assembly equipment segment to be the major revenue contributing segment in this market during the forecasted period.

The APAC region to continue dominating this market during the forecast period. This region currently accounts for more than 65% of the total revenue share. The presence of leading semiconductor foundries in this region, such as Taiwan Semiconductor Manufacturing, United Microelectronics, Samsung, and Semiconductor Manufacturing International, is expected to impel market growth during the forecast period.

The worldwide market for Semiconductor Packaging and Assembly Equipments is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.



Market Segment by Manufacturers, this report covers

    Applied Materials

    ASMPT

    DISCO Corporation

    EV Group

    Kulicke and Soffa Industries

    TEL

    Tokyo Seimitsu

    Rudolph Technologies

    SEMES

    Suss Microtec

    Ultratech

    Ulvac Technologies



Market Segment by Regions, regional analysis covers

    North America (United States, Canada and Mexico)

    Europe (Germany, France, UK, Russia and Italy)

    Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

    South America (Brazil, Argentina, Colombia etc.)

    Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)



Market Segment by Type, covers

    Die- Level Packaging and Assembly Equipment

    Wafer-Level Packaging and Assembly Equipment



Market Segment by Applications, can be divided into

    IDM (Integrated Device Manufacturers)

    OSAT (Outsourced Semiconductor Assembly and Test Companies)



There are 15 Chapters to deeply display the global Semiconductor Packaging and Assembly Equipments market.

Chapter 1, to describe Semiconductor Packaging and Assembly Equipments Introduction, product scope, market overview, market opportunities, market risk, market driving force;

Chapter 2, to analyze the top manufacturers of Semiconductor Packaging and Assembly Equipments, with sales, revenue, and price of Semiconductor Packaging and Assembly Equipments, in 2016 and 2017;

Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;

Chapter 4, to show the global market by regions, with sales, revenue and market share of Semiconductor Packaging and Assembly Equipments, for each region, from 2013 to 2018;

Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;

Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;

Chapter 12, Semiconductor Packaging and Assembly Equipments market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;

Chapter 13, 14 and 15, to describe Semiconductor Packaging and Assembly Equipments sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

Table of Contents



1 Market Overview

    1.1 Semiconductor Packaging and Assembly Equipments Introduction

    1.2 Market Analysis by Type

        1.2.1 Die- Level Packaging and Assembly Equipment

        1.2.2 Wafer-Level Packaging and Assembly Equipment

    1.3 Market Analysis by Applications

        1.3.1 IDM (Integrated Device Manufacturers)

        1.3.2 OSAT (Outsourced Semiconductor Assembly and Test Companies)

    1.4 Market Analysis by Regions

        1.4.1 North America (United States, Canada and Mexico)

            1.4.1.1 United States Market States and Outlook (2013-2023)

            1.4.1.2 Canada Market States and Outlook (2013-2023)

            1.4.1.3 Mexico Market States and Outlook (2013-2023)

        1.4.2 Europe (Germany, France, UK, Russia and Italy)

            1.4.2.1 Germany Market States and Outlook (2013-2023)

            1.4.2.2 France Market States and Outlook (2013-2023)

            1.4.2.3 UK Market States and Outlook (2013-2023)

            1.4.2.4 Russia Market States and Outlook (2013-2023)

            1.4.2.5 Italy Market States and Outlook (2013-2023)

        1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

            1.4.3.1 China Market States and Outlook (2013-2023)

            1.4.3.2 Japan Market States and Outlook (2013-2023)

            1.4.3.3 Korea Market States and Outlook (2013-2023)

            1.4.3.4 India Market States and Outlook (2013-2023)

            1.4.3.5 Southeast Asia Market States and Outlook (2013-2023)

        1.4.4 South America, Middle East and Africa

            1.4.4.1 Brazil Market States and Outlook (2013-2023)

            1.4.4.2 Egypt Market States and Outlook (2013-2023)

            1.4.4.3 Saudi Arabia Market States and Outlook (2013-2023)

            1.4.4.4 South Africa Market States and Outlook (2013-2023)

            1.4.4.5 Nigeria Market States and Outlook (2013-2023)

    1.5 Market Dynamics

        1.5.1 Market Opportunities

        1.5.2 Market Risk

        1.5.3 Market Driving Force

2 Manufacturers Profiles

    2.1 Applied Materials

        2.1.1 Business Overview

        2.1.2 Semiconductor Packaging and Assembly Equipments Type and Applications

            2.1.2.1 Product A

            2.1.2.2 Product B

        2.1.3 Applied Materials Semiconductor Packaging and Assembly Equipments Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.2 ASMPT

        2.2.1 Business Overview

        2.2.2 Semiconductor Packaging and Assembly Equipments Type and Applications

            2.2.2.1 Product A

            2.2.2.2 Product B

        2.2.3 ASMPT Semiconductor Packaging and Assembly Equipments Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.3 DISCO Corporation

        2.3.1 Business Overview

        2.3.2 Semiconductor Packaging and Assembly Equipments Type and Applications

            2.3.2.1 Product A

            2.3.2.2 Product B

        2.3.3 DISCO Corporation Semiconductor Packaging and Assembly Equipments Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.4 EV Group

        2.4.1 Business Overview

        2.4.2 Semiconductor Packaging and Assembly Equipments Type and Applications

            2.4.2.1 Product A

            2.4.2.2 Product B

        2.4.3 EV Group Semiconductor Packaging and Assembly Equipments Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.5 Kulicke and Soffa Industries

        2.5.1 Business Overview

        2.5.2 Semiconductor Packaging and Assembly Equipments Type and Applications

            2.5.2.1 Product A

            2.5.2.2 Product B

        2.5.3 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipments Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.6 TEL

        2.6.1 Business Overview

        2.6.2 Semiconductor Packaging and Assembly Equipments Type and Applications

            2.6.2.1 Product A

            2.6.2.2 Product B

        2.6.3 TEL Semiconductor Packaging and Assembly Equipments Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.7 Tokyo Seimitsu

        2.7.1 Business Overview

        2.7.2 Semiconductor Packaging and Assembly Equipments Type and Applications

            2.7.2.1 Product A

            2.7.2.2 Product B

        2.7.3 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipments Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.8 Rudolph Technologies

        2.8.1 Business Overview

        2.8.2 Semiconductor Packaging and Assembly Equipments Type and Applications

            2.8.2.1 Product A

            2.8.2.2 Product B

        2.8.3 Rudolph Technologies Semiconductor Packaging and Assembly Equipments Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.9 SEMES

        2.9.1 Business Overview

        2.9.2 Semiconductor Packaging and Assembly Equipments Type and Applications

            2.9.2.1 Product A

            2.9.2.2 Product B

        2.9.3 SEMES Semiconductor Packaging and Assembly Equipments Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.10 Suss Microtec

        2.10.1 Business Overview

        2.10.2 Semiconductor Packaging and Assembly Equipments Type and Applications

            2.10.2.1 Product A

            2.10.2.2 Product B

        2.10.3 Suss Microtec Semiconductor Packaging and Assembly Equipments Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.11 Ultratech

        2.11.1 Business Overview

        2.11.2 Semiconductor Packaging and Assembly Equipments Type and Applications

            2.11.2.1 Product A

            2.11.2.2 Product B

        2.11.3 Ultratech Semiconductor Packaging and Assembly Equipments Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.12 Ulvac Technologies

        2.12.1 Business Overview

        2.12.2 Semiconductor Packaging and Assembly Equipments Type and Applications

            2.12.2.1 Product A

            2.12.2.2 Product B

        2.12.3 Ulvac Technologies Semiconductor Packaging and Assembly Equipments Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

3 Global Semiconductor Packaging and Assembly Equipments Sales, Revenue, Market Share and Competition by Manufacturer (2016-2017)

    3.1 Global Semiconductor Packaging and Assembly Equipments Sales and Market Share by Manufacturer (2016-2017)

    3.2 Global Semiconductor Packaging and Assembly Equipments Revenue and Market Share by Manufacturer (2016-2017)

    3.3 Market Concentration Rate

        3.3.1 Top 3 Semiconductor Packaging and Assembly Equipments Manufacturer Market Share in 2017

        3.3.2 Top 6 Semiconductor Packaging and Assembly Equipments Manufacturer Market Share in 2017

    3.4 Market Competition Trend

4 Global Semiconductor Packaging and Assembly Equipments Market Analysis by Regions

    4.1 Global Semiconductor Packaging and Assembly Equipments Sales, Revenue and Market Share by Regions

        4.1.1 Global Semiconductor Packaging and Assembly Equipments Sales and Market Share by Regions (2013-2018)

        4.1.2 Global Semiconductor Packaging and Assembly Equipments Revenue and Market Share by Regions (2013-2018)

    4.2 North America Semiconductor Packaging and Assembly Equipments  Sales and Growth Rate (2013-2018)

    4.3 Europe Semiconductor Packaging and Assembly Equipments  Sales and Growth Rate (2013-2018)

    4.4 Asia-Pacific Semiconductor Packaging and Assembly Equipments  Sales and Growth Rate (2013-2018)

    4.5 South America Semiconductor Packaging and Assembly Equipments  Sales and Growth Rate (2013-2018)

    4.6 Middle East and Africa Semiconductor Packaging and Assembly Equipments  Sales and Growth Rate (2013-2018)

5 North America Semiconductor Packaging and Assembly Equipments by Countries

    5.1 North America Semiconductor Packaging and Assembly Equipments Sales, Revenue and Market Share by Countries

        5.1.1 North America Semiconductor Packaging and Assembly Equipments Sales and Market Share by Countries (2013-2018)

        5.1.2 North America Semiconductor Packaging and Assembly Equipments Revenue and Market Share by Countries (2013-2018)

    5.2 United States Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    5.3 Canada Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    5.4 Mexico Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

6 Europe Semiconductor Packaging and Assembly Equipments by Countries

    6.1 Europe Semiconductor Packaging and Assembly Equipments Sales, Revenue and Market Share by Countries

        6.1.1 Europe Semiconductor Packaging and Assembly Equipments Sales and Market Share by Countries (2013-2018)

        6.1.2 Europe Semiconductor Packaging and Assembly Equipments Revenue and Market Share by Countries (2013-2018)

    6.2 Germany Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    6.3 UK Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    6.4 France Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    6.5 Russia Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    6.6 Italy Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

7 Asia-Pacific Semiconductor Packaging and Assembly Equipments by Countries

    7.1 Asia-Pacific Semiconductor Packaging and Assembly Equipments Sales, Revenue and Market Share by Countries

        7.1.1 Asia-Pacific Semiconductor Packaging and Assembly Equipments Sales and Market Share by Countries (2013-2018)

        7.1.2 Asia-Pacific Semiconductor Packaging and Assembly Equipments Revenue and Market Share by Countries (2013-2018)

    7.2 China Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    7.3 Japan Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    7.4 Korea Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    7.5 India Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    7.6 Southeast Asia Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

8 South America Semiconductor Packaging and Assembly Equipments by Countries

    8.1 South America Semiconductor Packaging and Assembly Equipments Sales, Revenue and Market Share by Countries

        8.1.1 South America Semiconductor Packaging and Assembly Equipments Sales and Market Share by Countries (2013-2018)

        8.1.2 South America Semiconductor Packaging and Assembly Equipments Revenue and Market Share by Countries (2013-2018)

    8.2 Brazil Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    8.3 Argentina Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    8.4 Colombia Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

9 Middle East and Africa Semiconductor Packaging and Assembly Equipments by Countries

    9.1 Middle East and Africa Semiconductor Packaging and Assembly Equipments Sales, Revenue and Market Share by Countries

        9.1.1 Middle East and Africa Semiconductor Packaging and Assembly Equipments Sales and Market Share by Countries (2013-2018)

        9.1.2 Middle East and Africa Semiconductor Packaging and Assembly Equipments Revenue and Market Share by Countries (2013-2018)

    9.2 Saudi Arabia Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    9.3 UAE Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    9.4 Egypt Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    9.5 Nigeria Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

    9.6 South Africa Semiconductor Packaging and Assembly Equipments Sales and Growth Rate (2013-2018)

10 Global Semiconductor Packaging and Assembly Equipments Market Segment by Type

    10.1 Global Semiconductor Packaging and Assembly Equipments Sales, Revenue and Market Share by Type (2013-2018)

        10.1.1 Global Semiconductor Packaging and Assembly Equipments Sales and Market Share by Type (2013-2018)

        10.1.2 Global Semiconductor Packaging and Assembly Equipments Revenue and Market Share by Type (2013-2018)

    10.2 Die- Level Packaging and Assembly Equipment Sales Growth and Price

        10.2.1 Global Die- Level Packaging and Assembly Equipment Sales Growth (2013-2018)

        10.2.2 Global Die- Level Packaging and Assembly Equipment Price (2013-2018)

    10.3 Wafer-Level Packaging and Assembly Equipment Sales Growth and Price

        10.3.1 Global Wafer-Level Packaging and Assembly Equipment Sales Growth (2013-2018)

        10.3.2 Global Wafer-Level Packaging and Assembly Equipment Price (2013-2018)

11 Global Semiconductor Packaging and Assembly Equipments Market Segment by Application

    11.1 Global Semiconductor Packaging and Assembly Equipments Sales Market Share by Application (2013-2018)

    11.2 IDM (Integrated Device Manufacturers) Sales Growth (2013-2018)

    11.3 OSAT (Outsourced Semiconductor Assembly and Test Companies) Sales Growth (2013-2018)

12 Semiconductor Packaging and Assembly Equipments Market Forecast (2018-2023)

    12.1 Global Semiconductor Packaging and Assembly Equipments Sales, Revenue and Growth Rate (2018-2023)

    12.2 Semiconductor Packaging and Assembly Equipments Market Forecast by Regions (2018-2023)

        12.2.1 North America Semiconductor Packaging and Assembly Equipments Market Forecast (2018-2023)

        12.2.2 Europe Semiconductor Packaging and Assembly Equipments Market Forecast (2018-2023)

        12.2.3 Asia-Pacific Semiconductor Packaging and Assembly Equipments Market Forecast (2018-2023)

        12.2.4 South America Semiconductor Packaging and Assembly Equipments Market Forecast (2018-2023)

        12.2.5 Middle East and Africa Semiconductor Packaging and Assembly Equipments Market Forecast (2018-2023)

    12.3 Semiconductor Packaging and Assembly Equipments Market Forecast by Type (2018-2023)

        12.3.1 Global Semiconductor Packaging and Assembly Equipments Sales Forecast by Type (2018-2023)

        12.3.2 Global Semiconductor Packaging and Assembly Equipments Market Share Forecast by Type (2018-2023)

    12.4 Semiconductor Packaging and Assembly Equipments Market Forecast by Application (2018-2023)

        12.4.1 Global Semiconductor Packaging and Assembly Equipments Sales Forecast by Application (2018-2023)

        12.4.2 Global Semiconductor Packaging and Assembly Equipments Market Share Forecast by Application (2018-2023)

13 Sales Channel, Distributors, Traders and Dealers

    13.1 Sales Channel

        13.1.1 Direct Marketing

        13.1.2 Indirect Marketing

        13.1.3 Marketing Channel Future Trend

    13.2 Distributors, Traders and Dealers

14 Research Findings and Conclusion

15 Appendix

    15.1 Methodology

    15.2 Data Source


                        
            

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