In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

Scope of the Report:

This report focuses on the 3D IC and 2.5D IC in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period

In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.

The worldwide market for 3D IC and 2.5D IC is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.

Market Segment by Manufacturers, this report covers

TSMC (Taiwan)

Samsung (South Korea)

Toshiba (Japan)

ASE Group (Taiwan)

Amkor (U.S.)

UMC (Taiwan)

Stmicroelectronics (Switzerland)

Broadcom (U.S.)

Intel (U.S.)

Jiangsu Changjiang Electronics (China)

Market Segment by Regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia and Italy)

Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

South America (Brazil, Argentina, Colombia etc.)

Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers

3D wafer-level chip-scale packaging

3D TSV

2.5D

Market Segment by Applications, can be divided into

Consumer electronics

Telecommunication

Industry sector

Automotive

Military and Aerospace

Smart technologies

Medical devices

There are 15 Chapters to deeply display the global 3D IC and 2.5D IC market.

Chapter 1, to describe 3D IC and 2.5D IC Introduction, product scope, market overview, market opportunities, market risk, market driving force;

Chapter 2, to analyze the top manufacturers of 3D IC and 2.5D IC, with sales, revenue, and price of 3D IC and 2.5D IC, in 2016 and 2017;

Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;

Chapter 4, to show the global market by regions, with sales, revenue and market share of 3D IC and 2.5D IC, for each region, from 2013 to 2018;

Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;

Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;

Chapter 12, 3D IC and 2.5D IC market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;

Chapter 13, 14 and 15, to describe 3D IC and 2.5D IC sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

Frequently Asked Questions

These dominant industry players use well planned strategies to occupied highest market share in this market. Some of the top players in [Keyword] business includes. [Company list]
As per [Keyword] market analysis, North America is forecasted to occupied major share in the [Keyword] market.
The statistical data of the dominant industry player of [Keyword] market can be acquired from the company profile segment described in the report. This segment come up with analysis of major player’s in the [Keyword] market, also their last five-year revenue, segmental, product offerings, key strategies adopted and geographical revenue produced.
The report come up with a segment of the [Keyword] market based on Type, Region, and Application, Also offer a determined view on the [Keyword] market.
The report offers a nitty-gritty estimation of the market by providing data on various viewpoints that incorporate, restraints, drivers, and opportunities threats. This data can help in making suitable decisions for stakeholders before investing.
The sample report for [Keyword] market can be received after the apply from the website.

Table Of Content

Table of Contents



1 Market Overview

    1.1 3D IC and 2.5D IC Introduction

    1.2 Market Analysis by Type

        1.2.1 3D wafer-level chip-scale packaging

        1.2.2 3D TSV

        1.2.3 2.5D

    1.3 Market Analysis by Applications

        1.3.1 Consumer electronics

        1.3.2 Telecommunication

        1.3.3 Industry sector

        1.3.4 Automotive

        1.3.5 Military and Aerospace

        1.3.6 Smart technologies

        1.3.7 Medical devices

    1.4 Market Analysis by Regions

        1.4.1 North America (United States, Canada and Mexico)

            1.4.1.1 United States Market States and Outlook (2013-2023)

            1.4.1.2 Canada Market States and Outlook (2013-2023)

            1.4.1.3 Mexico Market States and Outlook (2013-2023)

        1.4.2 Europe (Germany, France, UK, Russia and Italy)

            1.4.2.1 Germany Market States and Outlook (2013-2023)

            1.4.2.2 France Market States and Outlook (2013-2023)

            1.4.2.3 UK Market States and Outlook (2013-2023)

            1.4.2.4 Russia Market States and Outlook (2013-2023)

            1.4.2.5 Italy Market States and Outlook (2013-2023)

        1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

            1.4.3.1 China Market States and Outlook (2013-2023)

            1.4.3.2 Japan Market States and Outlook (2013-2023)

            1.4.3.3 Korea Market States and Outlook (2013-2023)

            1.4.3.4 India Market States and Outlook (2013-2023)

            1.4.3.5 Southeast Asia Market States and Outlook (2013-2023)

        1.4.4 South America, Middle East and Africa

            1.4.4.1 Brazil Market States and Outlook (2013-2023)

            1.4.4.2 Egypt Market States and Outlook (2013-2023)

            1.4.4.3 Saudi Arabia Market States and Outlook (2013-2023)

            1.4.4.4 South Africa Market States and Outlook (2013-2023)

            1.4.4.5 Nigeria Market States and Outlook (2013-2023)

    1.5 Market Dynamics

        1.5.1 Market Opportunities

        1.5.2 Market Risk

        1.5.3 Market Driving Force

2 Manufacturers Profiles

    2.1 TSMC (Taiwan)

        2.1.1 Business Overview

        2.1.2 3D IC and 2.5D IC Type and Applications

            2.1.2.1 Product A

            2.1.2.2 Product B

        2.1.3 TSMC (Taiwan) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.2 Samsung (South Korea)

        2.2.1 Business Overview

        2.2.2 3D IC and 2.5D IC Type and Applications

            2.2.2.1 Product A

            2.2.2.2 Product B

        2.2.3 Samsung (South Korea) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.3 Toshiba (Japan)

        2.3.1 Business Overview

        2.3.2 3D IC and 2.5D IC Type and Applications

            2.3.2.1 Product A

            2.3.2.2 Product B

        2.3.3 Toshiba (Japan) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.4 ASE Group (Taiwan)

        2.4.1 Business Overview

        2.4.2 3D IC and 2.5D IC Type and Applications

            2.4.2.1 Product A

            2.4.2.2 Product B

        2.4.3 ASE Group (Taiwan) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.5 Amkor (U.S.)

        2.5.1 Business Overview

        2.5.2 3D IC and 2.5D IC Type and Applications

            2.5.2.1 Product A

            2.5.2.2 Product B

        2.5.3 Amkor (U.S.) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.6 UMC (Taiwan)

        2.6.1 Business Overview

        2.6.2 3D IC and 2.5D IC Type and Applications

            2.6.2.1 Product A

            2.6.2.2 Product B

        2.6.3 UMC (Taiwan) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.7 Stmicroelectronics (Switzerland)

        2.7.1 Business Overview

        2.7.2 3D IC and 2.5D IC Type and Applications

            2.7.2.1 Product A

            2.7.2.2 Product B

        2.7.3 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.8 Broadcom (U.S.)

        2.8.1 Business Overview

        2.8.2 3D IC and 2.5D IC Type and Applications

            2.8.2.1 Product A

            2.8.2.2 Product B

        2.8.3 Broadcom (U.S.) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.9 Intel (U.S.)

        2.9.1 Business Overview

        2.9.2 3D IC and 2.5D IC Type and Applications

            2.9.2.1 Product A

            2.9.2.2 Product B

        2.9.3 Intel (U.S.) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

    2.10 Jiangsu Changjiang Electronics (China)

        2.10.1 Business Overview

        2.10.2 3D IC and 2.5D IC Type and Applications

            2.10.2.1 Product A

            2.10.2.2 Product B

        2.10.3 Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

3 Global 3D IC and 2.5D IC Sales, Revenue, Market Share and Competition by Manufacturer (2016-2017)

    3.1 Global 3D IC and 2.5D IC Sales and Market Share by Manufacturer (2016-2017)

    3.2 Global 3D IC and 2.5D IC Revenue and Market Share by Manufacturer (2016-2017)

    3.3 Market Concentration Rate

        3.3.1 Top 3 3D IC and 2.5D IC Manufacturer Market Share in 2017

        3.3.2 Top 6 3D IC and 2.5D IC Manufacturer Market Share in 2017

    3.4 Market Competition Trend

4 Global 3D IC and 2.5D IC Market Analysis by Regions

    4.1 Global 3D IC and 2.5D IC Sales, Revenue and Market Share by Regions

        4.1.1 Global 3D IC and 2.5D IC Sales and Market Share by Regions (2013-2018)

        4.1.2 Global 3D IC and 2.5D IC Revenue and Market Share by Regions (2013-2018)

    4.2 North America 3D IC and 2.5D IC  Sales and Growth Rate (2013-2018)

    4.3 Europe 3D IC and 2.5D IC  Sales and Growth Rate (2013-2018)

    4.4 Asia-Pacific 3D IC and 2.5D IC  Sales and Growth Rate (2013-2018)

    4.5 South America 3D IC and 2.5D IC  Sales and Growth Rate (2013-2018)

    4.6 Middle East and Africa 3D IC and 2.5D IC  Sales and Growth Rate (2013-2018)

5 North America 3D IC and 2.5D IC by Countries

    5.1 North America 3D IC and 2.5D IC Sales, Revenue and Market Share by Countries

        5.1.1 North America 3D IC and 2.5D IC Sales and Market Share by Countries (2013-2018)

        5.1.2 North America 3D IC and 2.5D IC Revenue and Market Share by Countries (2013-2018)

    5.2 United States 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    5.3 Canada 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    5.4 Mexico 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

6 Europe 3D IC and 2.5D IC by Countries

    6.1 Europe 3D IC and 2.5D IC Sales, Revenue and Market Share by Countries

        6.1.1 Europe 3D IC and 2.5D IC Sales and Market Share by Countries (2013-2018)

        6.1.2 Europe 3D IC and 2.5D IC Revenue and Market Share by Countries (2013-2018)

    6.2 Germany 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    6.3 UK 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    6.4 France 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    6.5 Russia 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    6.6 Italy 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

7 Asia-Pacific 3D IC and 2.5D IC by Countries

    7.1 Asia-Pacific 3D IC and 2.5D IC Sales, Revenue and Market Share by Countries

        7.1.1 Asia-Pacific 3D IC and 2.5D IC Sales and Market Share by Countries (2013-2018)

        7.1.2 Asia-Pacific 3D IC and 2.5D IC Revenue and Market Share by Countries (2013-2018)

    7.2 China 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    7.3 Japan 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    7.4 Korea 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    7.5 India 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    7.6 Southeast Asia 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

8 South America 3D IC and 2.5D IC by Countries

    8.1 South America 3D IC and 2.5D IC Sales, Revenue and Market Share by Countries

        8.1.1 South America 3D IC and 2.5D IC Sales and Market Share by Countries (2013-2018)

        8.1.2 South America 3D IC and 2.5D IC Revenue and Market Share by Countries (2013-2018)

    8.2 Brazil 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    8.3 Argentina 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    8.4 Colombia 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

9 Middle East and Africa 3D IC and 2.5D IC by Countries

    9.1 Middle East and Africa 3D IC and 2.5D IC Sales, Revenue and Market Share by Countries

        9.1.1 Middle East and Africa 3D IC and 2.5D IC Sales and Market Share by Countries (2013-2018)

        9.1.2 Middle East and Africa 3D IC and 2.5D IC Revenue and Market Share by Countries (2013-2018)

    9.2 Saudi Arabia 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    9.3 UAE 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    9.4 Egypt 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    9.5 Nigeria 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

    9.6 South Africa 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

10 Global 3D IC and 2.5D IC Market Segment by Type

    10.1 Global 3D IC and 2.5D IC Sales, Revenue and Market Share by Type (2013-2018)

        10.1.1 Global 3D IC and 2.5D IC Sales and Market Share by Type (2013-2018)

        10.1.2 Global 3D IC and 2.5D IC Revenue and Market Share by Type (2013-2018)

    10.2 3D wafer-level chip-scale packaging Sales Growth and Price

        10.2.1 Global 3D wafer-level chip-scale packaging Sales Growth (2013-2018)

        10.2.2 Global 3D wafer-level chip-scale packaging Price (2013-2018)

    10.3 3D TSV Sales Growth and Price

        10.3.1 Global 3D TSV Sales Growth (2013-2018)

        10.3.2 Global 3D TSV Price (2013-2018)

    10.4 2.5D Sales Growth and Price

        10.4.1 Global 2.5D Sales Growth (2013-2018)

        10.4.2 Global 2.5D Price (2013-2018)

11 Global 3D IC and 2.5D IC Market Segment by Application

    11.1 Global 3D IC and 2.5D IC Sales Market Share by Application (2013-2018)

    11.2 Consumer electronics Sales Growth (2013-2018)

    11.3 Telecommunication Sales Growth (2013-2018)

    11.4 Industry sector Sales Growth (2013-2018)

    11.5 Automotive Sales Growth (2013-2018)

    11.6 Military and Aerospace Sales Growth (2013-2018)

    11.7 Smart technologies Sales Growth (2013-2018)

    11.8 Medical devices Sales Growth (2013-2018)

12 3D IC and 2.5D IC Market Forecast (2018-2023)

    12.1 Global 3D IC and 2.5D IC Sales, Revenue and Growth Rate (2018-2023)

    12.2 3D IC and 2.5D IC Market Forecast by Regions (2018-2023)

        12.2.1 North America 3D IC and 2.5D IC Market Forecast (2018-2023)

        12.2.2 Europe 3D IC and 2.5D IC Market Forecast (2018-2023)

        12.2.3 Asia-Pacific 3D IC and 2.5D IC Market Forecast (2018-2023)

        12.2.4 South America 3D IC and 2.5D IC Market Forecast (2018-2023)

        12.2.5 Middle East and Africa 3D IC and 2.5D IC Market Forecast (2018-2023)

    12.3 3D IC and 2.5D IC Market Forecast by Type (2018-2023)

        12.3.1 Global 3D IC and 2.5D IC Sales Forecast by Type (2018-2023)

        12.3.2 Global 3D IC and 2.5D IC Market Share Forecast by Type (2018-2023)

    12.4 3D IC and 2.5D IC Market Forecast by Application (2018-2023)

        12.4.1 Global 3D IC and 2.5D IC Sales Forecast by Application (2018-2023)

        12.4.2 Global 3D IC and 2.5D IC Market Share Forecast by Application (2018-2023)

13 Sales Channel, Distributors, Traders and Dealers

    13.1 Sales Channel

        13.1.1 Direct Marketing

        13.1.2 Indirect Marketing

        13.1.3 Marketing Channel Future Trend

    13.2 Distributors, Traders and Dealers

14 Research Findings and Conclusion

15 Appendix

    15.1 Methodology

    15.2 Data Source

Inquiry For Buying

3D IC and 2.5D IC

Please fill out the form. We will contact you within 24 hours:
All fields required...

Request Sample

3D IC and 2.5D IC

Please fill out the form. We will contact you within 24 hours:
All fields required...

×

Avail Free PDF Sample Report

This website is secure and your personal details are safe. Privacy Policy

Thank you for contacting us.

Thank you for your interest in our research report.

We will be sending you the sample copy of the report shortly. Meanwhile, if you have any specific research requirement then please let us know. We will be glad to assist you in case you have any additional questions, so feel free to get in touch

Thank you

Warm regards,
Sales | Manager - International Business and partner Relations
Direct line: +1 347 535 0815
Market Research Store
E-mail: sales@MarketResearchStore.com | Web: www.MarketResearchStore.com